Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163954 | Trenched device wafer, stepped-sidewall device die, and associated method | Yumei Su, Wei-Feng Lin | 2018-12-25 |
| 9935144 | System-in-package image sensor | Wei-Feng Lin, En-Chi Li | 2018-04-03 |