Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10110170 | Semiconductor package having an isolation wall to reduce electromagnetic coupling | Sarmad K. Musa, Fernando A. Santos, Mahesh K. Shah | 2018-10-23 |
| 10069462 | Multiple-stage RF amplifier devices | Seungkee Min, Henry Andre Christange | 2018-09-04 |
| 9978691 | Semiconductor packages having wire bond wall to reduce coupling | Shun-Meen Kuo, Paul R. Hart | 2018-05-22 |