Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10096534 | Thermal performance of logic chip in a package-on-package structure | Abraham Yee, Jayprakash Chipalkatti | 2018-10-09 |
| 10032692 | Semiconductor package structure | Brian Schieck, Abraham Yee | 2018-07-24 |