Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10064275 | Extending the lifetime of a leadless SMT solder joint using pads comprising spring-shaped traces | Haim Peretz | 2018-08-28 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10064275 | Extending the lifetime of a leadless SMT solder joint using pads comprising spring-shaped traces | Haim Peretz | 2018-08-28 |