Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10036774 | Integrated circuit device comprising environment-hardened die and less-environment-hardened die | Vikas Chandra | 2018-07-31 |
| 10002222 | System and method for perforating redundant metal in self-aligned multiple patterning | Brian Tracy Cline | 2018-06-19 |
| 9978942 | Correlated electron switch structures and applications | Lucian Shifren, Kimberly Gay Reid | 2018-05-22 |
| 9929149 | Using inter-tier vias in integrated circuits | Saurabh Sinha, Robert Campbell Aitken, Brian Tracy Cline, Kyungwook Chang | 2018-03-27 |
| 9875332 | Contact resistance mitigation | — | 2018-01-23 |