Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10159142 | Printed wiring board with a reinforcing member having a diffusion-bonded nickel layer | Yuusuke HARUNA, Hiroshi Tajima, Masahiro Watanabe, Yukari Kobayashi, Kiyoharu Sekiguchi | 2018-12-18 |