Issued Patents 2018
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10143088 | Method for producing wired circuit board | Hiroyuki Tanabe | 2018-11-27 |
| 10121503 | Suspension board with circuit having thinned insulating second portion overlapping second terminal | Hiroyuki Tanabe | 2018-11-06 |
| 10028378 | Suspension board with circuit and producing method thereof | Hiroyuki Tanabe, Naohiro Terada, Daisuke Yamauchi | 2018-07-17 |
| 9992868 | Wired circuit board having one of the conductive layers disposed in an opening formed in metal supporting board | — | 2018-06-05 |
| 9949370 | Suspension board with circuit and producing method thereof | Hiroyuki Tanabe, Naohiro Terada, Daisuke Yamauchi | 2018-04-17 |
| 9865287 | Suspension board with circuit and producing method thereof | Hiroyuki Tanabe, Yoshito FUJIMURA | 2018-01-09 |