Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10141217 | Dicing-tape integrated film for backside of semiconductor and method of manufacturing semiconductor device | Hiroyuki Hanazono, Akihiro Fukui | 2018-11-27 |
| 10014235 | Underfill material, laminated sheet and method for producing semiconductor device | Hiroyuki Hanazono, Akihiro Fukui | 2018-07-03 |
| 9911683 | Film for back surface of flip-chip semiconductor | Goji Shiga | 2018-03-06 |