Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10043728 | Semiconductor package structure and manufacturing method thereof | — | 2018-08-07 |
| 9947551 | Chip package structure and manufacturing method thereof | Hsiu-Wen Hsu | 2018-04-17 |
| 9881897 | Manufacturing method of ultra-thin semiconductor device package assembly | Hsiu-Wen Hsu | 2018-01-30 |