Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10056343 | Packaged semiconductor device with interior polygonal pads | Kan Wae Lam, Clifford J. Lloyd, Chi Hoo Wan, Fei Ying Wong | 2018-08-21 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10056343 | Packaged semiconductor device with interior polygonal pads | Kan Wae Lam, Clifford J. Lloyd, Chi Hoo Wan, Fei Ying Wong | 2018-08-21 |