Issued Patents 2018
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10095909 | Hybrid MEMs-floating gate device | Yakov Roizin, Rassul Karabalin | 2018-10-09 |
| 10062636 | Integration of thermally conductive but electrically isolating layers with semiconductor devices | — | 2018-08-28 |
| 10062644 | Copper interconnect for improving radio frequency (RF) silicon-on-insulator (SOI) switch field effect transistor (FET) stacks | Paul D. Hurwitz | 2018-08-28 |
| 9984888 | Method of fabricating a semiconductor wafer including a through substrate via (TSV) and a stepped support ring on a back side of the wafer | Hadi Jebory | 2018-05-29 |
| 9984269 | Fingerprint sensor with direct recording to non-volatile memory | Yakov Roizin, Rassul Karabalin | 2018-05-29 |
| 9966301 | Reduced substrate effects in monolithically integrated RF circuits | Michael J. DeBar, Paul D. Hurwitz | 2018-05-08 |
| 9917104 | Hybrid MOS-PCM CMOS SOI switch | Yakov Roizin, Paul D. Hurwitz | 2018-03-13 |
| 9887123 | Structure having isolated deep substrate vias with decreased pitch and increased aspect ratio and related method | Arjun Kar-Roy | 2018-02-06 |