Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9918392 | Method and apparatus for assembling a component with a flexible foil, as well as the assembled product | Gari Arutinov, Gerardus Titus Van Heck | 2018-03-13 |
| 9859247 | Method for bonding bare chip dies | Sandeep Menon Perinchery, Jeroen Van Den Brand, Rajesh Mandamparambil, Harmannus Franciscus Maria Schoo | 2018-01-02 |