Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10093533 | CMOS-MEMS-CMOS platform | Martin Lim | 2018-10-09 |
| 9975763 | Integration of AIN ultrasonic transducer on a CMOS substrate using fusion bonding process | Jong Il Shin, Jongwoo Shin | 2018-05-22 |
| 9919915 | Method and system for MEMS devices with dual damascene formed electrodes | Chunchieh Huang | 2018-03-20 |
| 9892922 | Methods for fabricating integrated circuits with triple gate oxide devices | Ning Cheng | 2018-02-13 |
| 9862593 | MEMS-CMOS device that minimizes outgassing and methods of manufacture | Jong Il Shin, Jongwoo Shin | 2018-01-09 |