Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163674 | Circular support substrate for semiconductor | Sommawan Khumpuang, Fumito IMURA, Michihiro Inoue, Arami Saruwatari | 2018-12-25 |
| 10163819 | Surface mount package and manufacturing method thereof | Sommawan Khumpuang, Fumito IMURA, Michihiro Inoue, Arami Saruwatari | 2018-12-25 |
| 10137570 | Link-type transfer robot | Kenji Hirota, Shinichi Imai, Hitoshi Maekawa | 2018-11-27 |
| 10115619 | Coupling transfer system | Hitoshi Maekawa | 2018-10-30 |