Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10072790 | Stepless rapid extendable multipod with built-in power supply | Kaizhi Chen, Glenn Mankit Tse, Yongsen Huang, Xingchao Li | 2018-09-11 |
| 9922950 | Method and structure for wafer-level packaging | — | 2018-03-20 |