Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9947604 | Epoxy resin composition, semiconductor sealing agent, and semiconductor device | Tomoya YAMAZAWA, Kodai Okoshi, Nobuyuki Abe | 2018-04-17 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9947604 | Epoxy resin composition, semiconductor sealing agent, and semiconductor device | Tomoya YAMAZAWA, Kodai Okoshi, Nobuyuki Abe | 2018-04-17 |