Issued Patents 2018
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10158157 | High-frequency signal line and manufacturing method thereof | Nobuo IKEMOTO, Yuki Wakabayashi | 2018-12-18 |
| 10028388 | Component-embedded substrate | Daisuke Tsuruga | 2018-07-17 |
| 9986139 | Camera module including multilayer base body, image sensor IC, lens unit, peripheral circuit components, and connector element and electronic device including same | Hirofumi Shinagawa, Jerry HSIEH, Satoshi Sasaki, Jun Sasaki, Nobuo IKEMOTO +1 more | 2018-05-29 |
| 9974185 | Component-embedded substrate | Hirofumi Shinagawa, Yuki Wakabayashi, Kuniaki YOSUI, Yuki Ito, Toshiro Adachi +2 more | 2018-05-15 |
| 9961780 | Method for manufacturing resin multilayer board | Hirofumi Shinagawa, Masaki KAWATA, Yuki Ito | 2018-05-01 |
| 9922918 | Substrate for stacked module, stacked module, and method for manufacturing stacked module | Hirofumi Shinagawa, Yuki Wakabayashi | 2018-03-20 |
| 9882256 | High-frequency signal transmission line and electronic apparatus | Noboru Kato, Jun Sasaki, Junichi Kurita, Satoshi Sasaki | 2018-01-30 |