Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10027353 | High-frequency front end circuit | Takanori UEJIMA, Saneaki Ariumi, Hisao Hayafuji, Tatsuya Tsujiguchi | 2018-07-17 |
| 10002710 | Ceramic multilayer wiring substrate and module including the same | — | 2018-06-19 |
| 9960898 | Radio frequency front-end circuit | Takanori UEJIMA, Saneaki Ariumi, Hisao Hayafuji, Tatsuya Tsujiguchi | 2018-05-01 |
| 9961764 | Circuit module | — | 2018-05-01 |
| 9948269 | High-frequency module | — | 2018-04-17 |