Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10034371 | Resin composition for printed wiring board, prepreg, metal foil-clad laminate, resin composite sheet, and printed wiring board | Kenji Arii, Takashi Kobayashi, Masanobu Sogame, Sotaro Hiramatsu | 2018-07-24 |
| 9944787 | Resin composition, prepreg and laminate | Chisato Saito, Daisuke Ueyama, Masanobu Sogame, Yoshihiro Kato | 2018-04-17 |
| 9949369 | Cyanate ester compound, curable resin composition containing the same, and hardened product thereof | Masayuki Katagiri, Keita Tokuzumi, Makoto Tsubuku, Tomoo Tsujimoto, Kenji Arii +3 more | 2018-04-17 |