Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9905328 | Resin composition for printed wiring board material and prepreg, resin sheet, metal foil-clad laminate, and printed wiring board using the same | Naoki KASHIMA, Takenori Takiguchi, Takaaki Ogashiwa | 2018-02-27 |