Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10153254 | Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices | Chin Hui Chong | 2018-12-11 |
| 10128217 | Memory devices with controllers under memory packages and associated systems and methods | Hong Wan Ng | 2018-11-13 |
| 10014281 | Methods of manufacturing a semiconductor device package including a controller element | Hong Wan Ng | 2018-07-03 |
| 9985000 | Stacked semiconductor die assemblies with die support members and associated systems and methods | Hong Wan Ng | 2018-05-29 |