Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10147510 | Electroplated AU for conformal coating of high aspect ratio silicon structures | Adam M. Rowen, Jonathan Joseph Coleman | 2018-12-04 |
| 9972565 | Lateral vias for connections to buried microconductors | David P. Adams, Kira L. Fishgrab, Karl Douglas Greth, Michael David Henry, Jeffrey Stevens +3 more | 2018-05-15 |