JM

Jack E. Murray

Micron: 1 patents #397 of 951Top 45%
📍 Boise, ID: #203 of 458 inventorsTop 45%
🗺 Idaho: #331 of 939 inventorsTop 40%
Overall (2018): #382,028 of 503,207Top 80%
1
Patents 2018

Issued Patents 2018

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10032703 Package-on-package semiconductor assemblies and methods of manufacturing the same Owen R. Fay 2018-07-24