Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9919472 | Stacking and bonding methods for forming multi-layer, three-dimensional, millimeter scale and microscale structures | Adam L. Cohen, Michael S. Lockard, Uri Frodis, Kieun Kim, Dennis R. Smalley | 2018-03-20 |