Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10146275 | 3D printed thermal management system | Lincoln Matthew Ghioni, Andrew W. Hill, Kurt Allen Jenkins, Robyn Rebecca Reed McLaughlin | 2018-12-04 |
| 10098259 | Heat dissipation in electronics | Robyn Rebecca Reed McLaughlin, Andrew W. Hill, Paul C. Bornemann | 2018-10-09 |
| 10054995 | Additive manufactured passive thermal enclosure | Kurt Allen Jenkins, Andrew Douglas Delano, Lincoln Matthew Ghioni | 2018-08-21 |
| D825498 | Heat sink assembly | Boyd Drew Allin | 2018-08-14 |