Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10152445 | Signal count reduction between semiconductor dies assembled in wafer-level package | — | 2018-12-11 |
| 10127169 | Supporting flow control mechanism of bus between semiconductor dies assembled in wafer-level package | — | 2018-11-13 |
| 9934179 | Wafer-level package with at least one input/output port connected to at least one management bus | — | 2018-04-03 |