Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9881904 | Multi-layer semiconductor devices fabricated using a combination of substrate and via structures and fabrication techniques | Rabindra N. Das, Mark A. Gouker, Pascale Gouker, Ryan C. Johnson | 2018-01-30 |