Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9976042 | Conductive paste, method for forming an interconnection and electrical device | Byung Hoon Lee, Chee Lip Gan, Mei Zhen Ng | 2018-05-22 |
| 9881895 | Wire bonding methods and systems incorporating metal nanoparticles | Randall M. Stoltenberg | 2018-01-30 |