Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10134939 | Optical sensor module and a wearable device including the same | Tsan-Yu Ho, Chen-Hsiu Lin | 2018-11-20 |
| 9985191 | LED package structure | KUO-MING CHIU, Hung-Jui Chen, Han-Hsing Peng | 2018-05-29 |
| 9978915 | Manufacturing method of a flip-chip light emitting diode package module | Ming-Kun Weng | 2018-05-22 |