Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10103286 | Packaging method of long-distance sensor | Ching-I Lin | 2018-10-16 |
| 10090427 | Package structure of long-distance sensor and packaging method of the same | Ching-I Lin | 2018-10-02 |
| 10003874 | Microphone package structure | Yao-Ting YEH | 2018-06-19 |
| 9952089 | Optical sensing module and method of manufacturing the same | Yu-Chang Huang | 2018-04-24 |
| 9905548 | Optical module integrated package | Yao-Ting YEH, Yu-Chen Lin | 2018-02-27 |