Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9974172 | Epoxy resin compound and radiant heat circuit board using the same | Hae Yeon Kim, Sung Bae Moon, Jeung Ook Park, Jong Heum Yoon, In Hee Cho | 2018-05-15 |
| 9902841 | Inorganic filler, resin composition comprising the same and heat radiation substrate using the same | Sang A Ju, Hyun Gu Im | 2018-02-27 |