Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10081744 | Adhesive composition having improved adhesive force for use as insulator | Ji Mun Kim, Eung Kee Lee, Myeong Hee KIM, Seung-Wook JI, Byung-Joo JEON | 2018-09-25 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10081744 | Adhesive composition having improved adhesive force for use as insulator | Ji Mun Kim, Eung Kee Lee, Myeong Hee KIM, Seung-Wook JI, Byung-Joo JEON | 2018-09-25 |