HI

Hiroyoshi Ichikura

LC Lapis Semiconductor Co.: 1 patents #8 of 55Top 15%
Overall (2018): #399,136 of 503,207Top 80%
1
Patents 2018

Issued Patents 2018

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10121721 Heat dissipation bump electrode for chip on film — 2018-11-06