Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10096526 | Die bonder and bonding method | Hiroshi Maki, Yukio Tani, Takehito Mochizuki | 2018-10-09 |
| 10007229 | Image forming apparatus that reduces remaining amount of developer during exchange of developer housing portion and method of releasing regulation on attachment/removal of developer housing portion | Tsuyoshi Terada | 2018-06-26 |
| 9975718 | Sheet feed device, image forming apparatus, and method for controlling sheet feed device | — | 2018-05-22 |
| 9921542 | Image forming apparatus for forming image using developer, method for regulating attachment/detachment of developer storage portion | Tsuyoshi Terada | 2018-03-20 |
| 9880493 | Image forming apparatus for forming image using developer, method for releasing regulation on attachment/detachment of developer storage portions | Tsuyoshi Terada | 2018-01-30 |