Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10083887 | Chip component-embedded resin multilayer substrate and manufacturing method thereof | Toru Yoshioka | 2018-09-25 |
| 9983001 | Shape analysis method and shape analysis program | Masafumi Shimizu | 2018-05-29 |