Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9921004 | Polymer-based microfabricated thermal ground plane | Ryan John Lewis, Yung-Cheng Lee, Yunda Wang | 2018-03-20 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9921004 | Polymer-based microfabricated thermal ground plane | Ryan John Lewis, Yung-Cheng Lee, Yunda Wang | 2018-03-20 |