Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10068775 | Method of bonding supporting substrate with device substrate for fabricating semiconductor device | Mika Fujii, Kazuyuki Higashi, Kazumichi Tsumura | 2018-09-04 |
TS
Takashi Shirono
Overall (2018): #219,477 of 503,207Top 45%
1
Patents 2018