Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163765 | Semiconductor device that includes a molecular bonding layer for bonding of elements | — | 2018-12-25 |
| 10147612 | Metal pattern forming method | Tsutomu Nakanishi, Yusuke Tanaka, Atsushi Hieno, Yasuhito Yoshimizu | 2018-12-04 |