Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10141283 | Sinterable bonding material and semiconductor device using the same | Hajime Inoue | 2018-11-27 |
| 9994681 | Organopolysiloxane prepolymer and a curable organopolysiloxane composition comprising the same | Hao Wu, Wenjuan Tan, Wentao Xing, Yong Zhang, Mieko Sano +5 more | 2018-06-12 |
| 9865551 | Methods to control wafer warpage upon compression molding thereof and articles useful therefor | Gina Hoang | 2018-01-09 |