Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10031163 | Compressible layer with integrated bridge in IC testing apparatus | Wei Kuong FOONG, Kok Sing GOH, Eng Kiat LEE | 2018-07-24 |
| 10018652 | Short contact in a testing apparatus for wireless integrated circuits | Wei Kuong FOONG, Kok Sing GOH, Eng Kiat LEE | 2018-07-10 |
| 10018653 | Kelvin contact assembly in a testing apparatus for integrated circuits | Wei Kuong FOONG, Kok Sing GOH, Eng Kiat LEE | 2018-07-10 |