Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10134710 | Semiconductor package | Takeshi Miyakoshi, Sumikazu Hosoyamada, Yoshikazu Kumagaya, Shingo Nakamura, Hiroaki Matsubara +1 more | 2018-11-20 |
| 9922931 | Interconnect structure, printed circuit board, semiconductor device, and manufacturing method for interconnect structure | Hiroaki Matsubara, Naoki Hayashi, Toshihiro Iwasaki | 2018-03-20 |