Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10049935 | Integrated circuit package having pin up interconnect | Zalina Binti Abdullah, Roslan Bin Ahmad, Poh Cheng Ang, Hai San Tew, Shin Hung Hwang +2 more | 2018-08-14 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10049935 | Integrated circuit package having pin up interconnect | Zalina Binti Abdullah, Roslan Bin Ahmad, Poh Cheng Ang, Hai San Tew, Shin Hung Hwang +2 more | 2018-08-14 |