Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9871010 | Tin alloy electroplating solution for solder bumps including perfluoroalkyl surfactant | Jung-Woo Ko, Jeong Hun Oh, Hyun-Kook Park, Heung Su JUNG | 2018-01-16 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9871010 | Tin alloy electroplating solution for solder bumps including perfluoroalkyl surfactant | Jung-Woo Ko, Jeong Hun Oh, Hyun-Kook Park, Heung Su JUNG | 2018-01-16 |