Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10123428 | Package module | Hai-Bin Xu, Tao Wang, Shou-Yu Hong | 2018-11-06 |
| 10096562 | Power module package | Le Liang, Kai Lu, Zeng Li | 2018-10-09 |
| 9875991 | Package module having exposed heat sink | Le Liang, Shou-Yu Hong | 2018-01-23 |