Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10023977 | Method for producing high stacking fault energy (SFE) metal films, foils, and coatings with high-density nanoscale twin boundaries | Xinghang Zhang, Daniel Bufford, Haiyan Wang | 2018-07-17 |
| 9876520 | Communication chip integrated with SIM card | Xiaodong Ren, Guangna Lv, Hongmei Wang | 2018-01-23 |