YI

Yuichi Ishida

JA Japan Aerospace Exploration Agency: 2 patents #1 of 38Top 3%
KA Kaneka: 2 patents #13 of 167Top 8%
SO Sony: 1 patents #1,041 of 2,835Top 40%
Overall (2018): #50,504 of 503,207Top 15%
3
Patents 2018

Issued Patents 2018

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
10097025 Electronic apparatus, method of controlling electronic apparatus, power reception device, electric device, and system Masakazu Yajima, Kiminobu Ichimura, Yutaka Sugiyama, Yoshio Muraoka 2018-10-09
10047246 Varnish including 2-phenyl-4,4′-diaminodiphenyl ether, imide resin composition having excellent moldability, cured resin molded article having excellent breaking elongation, prepreg thereof, imide prepreg thereof, and fiber-reinforced material thereof having high heat resistance and excellent mechanical strength Masahiko Miyauchi, Toshio Ogasawara, Rikio Yokota 2018-08-14
10017666 Polyimide resin composition and varnish produced from terminal-modified imide oligomer prepared using 2-phenyl-4,4′-diaminodiphenyl ether and thermoplastic aromatic polyimide prepared using oxydiphthalic acid, polyimide resin composition molded article and prepreg having excellent heat resistance and mechanical characteristic, and fiber-reinforced composite material thereof Masahiko Miyauchi, Toshio Ogasawara, Rikio Yokota 2018-07-10