YA

Yurika Araya

DI Disco: 1 patents #25 of 98Top 30%
Overall (2018): #179,972 of 503,207Top 40%
1
Patents 2018

Issued Patents 2018

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9892986 Packaged wafer manufacturing method and device chip manufacturing method Hideki Koshimizu, Xin Lu 2018-02-13