Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10147672 | Lead frame surface modifications for high voltage isolation | Sadia Arefin Khan, Benjamin Stassen Cook | 2018-12-04 |
| 9865527 | Packaged semiconductor device having nanoparticle adhesion layer patterned into zones of electrical conductance and insulation | Benjamin Stassen Cook | 2018-01-09 |