Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9865516 | Wafers having a die region and a scribe-line region adjacent to the die region | Tzung-Han Lee, Chun-Yi Wu, Sheng-Yu Yan | 2018-01-09 |
YC
Yi Cheng
Overall (2018): #185,593 of 503,207Top 40%
1
Patents 2018