Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10150667 | Panel level packaging for MEMS application | Omar J. Bchir | 2018-12-11 |
| 10131534 | Stacked vias for vertical integration | Lixia Zhou | 2018-11-20 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10150667 | Panel level packaging for MEMS application | Omar J. Bchir | 2018-12-11 |
| 10131534 | Stacked vias for vertical integration | Lixia Zhou | 2018-11-20 |